(Hong Kong)
Product Summary
The UPC2745TB-E3 is a silicon monolithic integrated circuit designed as buffer amplifier for mobile communications. The UPC2745TB-E3 is packaged in super minimold package which is smaller than conventional minimold. The application of the UPC2745TB-E3 includes 1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.)
Parametrics
UPC2745TB-E3 absolute maximum ratings: (1)Supply voltage VCC TA = +25℃: 4.0V; (2)Circuit current ICC TA = +25℃: 16mA; (3)Input power level Pin TA = +25℃: 0dBm; (4)Total power dissipation PD Mounted on double sided copper clad; (5)50×50×1.6 mm epoxy glass PWB (TA = +85℃): 200mW; (6)Operating ambient temperature TA: -40℃ to +85℃; (7)Storage temperature TSTG: -55℃ to +150℃.
Features
UPC2745TB-E3 features: (1) High-density surface mounting: 6 pin super minimold package; (2) Supply voltage: Recommended VCC = 2.7 to 3.3 V, Circuit operation VCC = 1.8 to 3.3 V; (3) Wideband response: fu = 2.7GHz TYP. @UPC2745TB; (4) High isolation: ISL = 38dBTYP. @UPC2745TB.
Diagrams
| Image | Part No | Mfg | Description |  |
Pricing (USD) |
Quantity | ||||||||||
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 UPC2745TB-E3 |
NEC/CEL |
RF Amplifier 3V Widebnd Amplifier |
Data Sheet |
Negotiable |
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UPC2745TB-E3-A |
CEL |
RF Amplifier 3V Widebnd Amplifier |
Data Sheet |
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